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Category
- Fabrication and Processing ยป Nanofabrication
Booking Details
Facility Management Team and Location
Facility Features, Working Principle and Specifications
Facility Description
The ICP-RIE (Inductively Coupled Plasma Reactive Ion Etching) system is a highly advanced tool used for dry etching in the fabrication of micro- and nanostructures. It provides high precision, high anisotropy, and high selectivity in etching processes.
The system can achieve highly anisotropic etching (vertical sidewalls) and high etching selectivity between different materials
RIE involves a combination of chemical and physical etching, where reactive gases are introduced into the chamber and ionized by the plasma, and ions are accelerated toward the substrate, causing etching (material removal).
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Instructions for Registration, Sample Preparation, User Instructions and Precautionary Measures
https://www.iitbnf.iitb.ac.in/iitbnf/operation/lab-access-procedure.php
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Charges for Analytical Services in Different Categories
In Progress
Applications
Lithography tool
Sample Details
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Diamond, Si, SiO2
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small pieces upo 4 inch
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Na and K not allowed
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