External users: registration to be carried out only through I-STEM portal
Additional information about sample and analysis details should be filled in the pdf form provided in the I-STEM portal under “DOWNLOAD CSRF”
Internal users (IITB): registration to be carried out only through DRONA portal
Additional information about sample and analysis details should be filled in the pdf form provided here.
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Category
- Fabrication and Processing » Nanofabrication
- Fabrication and Processing » Nanofabrication
Booking Details
Facility Management Team and Location
Facility Features, Working Principle and Specifications
Facility Description
Sputter deposition is a physical vapour deposition (PVD) method of depositing thin films by sputtering material from a 'target', then depositing it onto a 'substrate'. Magnetron sputtering applies a magnetic field around the target in order to energize argon atoms for bombarding the target.
Target Size: 2”
Gases used in the system: O2, Ar, PN2
Substrates used: Si,
Substrate size: Small samples, 2” and 4” diameter wafer.
Magnetic targets allowed
Sample Preparation, User Instructions and Precautionary Measures
Charges for Analytical Services in Different Categories
All charges are in INR
Internal- 2500
External Academia - 4500
Start - up - 5625
R&D - 6750
Industry - 10000
Applications
Thin film deposition, metal contacts
Sample Details
NA
Si
N2, O2
2 inch to 4 inch
2 inch
Na and K not allowed