MTJ Sputter
Make
AJA International
Model
Orion-8-CH1
Facility Status
Working
Date of Installation
Facility Management Division
Centre for Sophisticated Instruments and Facilities (CSIF)-IoE Funded

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Category

  • Fabrication and Processing » Nanofabrication
  • Fabrication and Processing » Nanofabrication

Booking Details

Booking available for
Internal

Facility Management Team and Location

Facility In Charge
Prof. Ashwin Tulapurkar
Facility Manager
Dr. Deepti Rukade
Facility Operator
Ms. Akanksha, Mr. Arpit
Facility Management Members
Prof. Ashwin Tulapurkar, Prof. Dipankar Saha, Prof. Saurabh Lodha
Department
Electrical Engineering
Lab Email ID
query.iitbnf@gmail.com
Facility Location
Nano 2 Lab, Ground floor, IITBNF,EE Annex
Lab Phone No
022 2159 3552

Facility Features, Working Principle and Specifications

Facility Description

Facility Description

Sputter deposition is a physical vapour deposition (PVD) method of depositing thin films by sputtering material from a 'target', then depositing it onto a 'substrate'. Magnetron sputtering applies a magnetic field around the target in order to energize argon atoms for bombarding the target.

Features Working Principle

Target Size: 2”

 Gases used in the system: O2, Ar, PN2 

 Substrates used: Si,

Substrate size: Small samples, 2” and 4” diameter wafer.

Magnetic targets allowed

Instructions for Registration, Sample Preparation, User Instructions and Precautionary Measures

Instructions for Registration

https://www.iitbnf.iitb.ac.in/iitbnf/operation/lab-access-procedure.php

Charges for Analytical Services in Different Categories

Usage Charges

In progress

Applications

Thin film deposition, metal contacts 

Sample Details

Chemical allowed

NA

Allowed Substrate

Si

Gases allowed

N2, O2

Substrate Dimension

2 inch to 4 inch 

Target dimension

2 inch

Contamination remarks

Na and K not allowed

SOP, Lab Policies and Other Details

Publications